{"id":959,"date":"2018-07-16T21:29:56","date_gmt":"2018-07-17T00:29:56","guid":{"rendered":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/?page_id=959"},"modified":"2018-08-27T15:59:41","modified_gmt":"2018-08-27T18:59:41","slug":"tutorial-fernando-guarin","status":"publish","type":"page","link":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/tutorial-fernando-guarin\/","title":{"rendered":"Tutorial: Fernando Guarin"},"content":{"rendered":"

Fernando Guarin<\/span>
\nGlobalFoundries East Fishkill – USA<\/span>
\n<\/strong>Tuesday, Aug. 28 – 16:20h –\u00a0Malbec A<\/strong><\/span><\/p>\n

\"\"<\/p>\n

TUTORIAL
\nReliability challenges for the qualification of Leading Edge Silicon CMOS Technologies including RF Applications<\/strong><\/h2>\n

This presentation will address some of the key reliability challenges during the qualification of \u00a0leading edge CMOS technologies.\u00a0 Some of the issues are driven by self heating in SOI and some by the latest trends in semiconductor fabrication as we continue to scale and deal with the new reliability challenges introduced by the use of High K Metal Gate (HKMG) and FinFet devices. We will discuss the reliability impact and the qualification activities driven by the introduction of SOI and new materials. \u00a0\u00a0\u00a0The path to maintaining the advanced CMOS scaling cadence and new reliability limiting factors will be examined from the reliability perspective. We will also review the reliability requirements for RF reliability devices and applications as we prepare to introduce technologies to serve the 5G introductions requirement. A closer look will be given to Hot Carriers, Bias Temperature Instabilities and Gate Dielectric Integrity.\u00a0 The characterization, models and qualification methodologies will be put in the required perspective for the successful qualification and transfer of leading edge technologies to a manufacturing environment.<\/p>\n

Speaker’s Biography:<\/strong><\/h2>\n

Dr. Fernando Guar\u00edn is a Distinguished Member of Technical Staff at Global Foundries in East Fishkill NY and Adjunct Lecturer at SUNY New Paltz. He retired from IBM\u2019s SRDC after 27 years as Senior Member of Technical Staff.\u00a0 He earned his BSEE from the \u201cPontificia Universidad Javeriana\u201d, in Bogot\u00e1, Colombia, the M.S.E.E. degree from the University of Arizona, and the Ph.D. in Electrical Engineering from Columbia University, NY He has been actively working in microelectronic reliability for over 35 years.<\/p>\n

From 1980 until 1988 he worked in the Military and Aerospace Operations division of National Semiconductor Corporation.\u00a0 In 1988 he joined IBM\u2019s microelectronics division where he worked in the reliability physics and modeling of Advanced Bipolar, CMOS and Silicon Germanium BiCMOS technologies.<\/p>\n

Dr. Guar\u00edn is an IEEE Fellow, Distinguished Lecturer for the IEEE Electron Device Society, where he has served in many capacities including;\u00a0 member of the IEEE\u2019s EDS Board of governors,\u00a0 chair of the EDS Education Committee, Secretary for EDS. He is the EDS President 2017-2018.<\/p>\n

 <\/p>\n

Tutorial realized together with the 2018 EDS Brazil Mini-Colloquium, co-organized by EDS FEI Student Chapter.\u00a0<\/strong><\/span><\/em><\/p>\n","protected":false},"excerpt":{"rendered":"

Fernando Guarin GlobalFoundries East Fishkill – USA Tuesday, Aug. 28 – 16:20h –\u00a0Malbec A TUTORIAL Reliability challenges for the qualification of Leading Edge Silicon CMOS Technologies including RF Applications This presentation will address some...<\/p>\n","protected":false},"author":685,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"jetpack_post_was_ever_published":false,"footnotes":""},"class_list":["post-959","page","type-page","status-publish","hentry"],"jetpack_sharing_enabled":true,"jetpack_shortlink":"https:\/\/wp.me\/P9e0OP-ft","jetpack_likes_enabled":false,"jetpack-related-posts":[{"id":1095,"url":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/sforum-2018-technical-program\/","url_meta":{"origin":959,"position":0},"title":"SFORUM 2018 Technical Program","author":"agostini","date":"23\/07\/2018","format":false,"excerpt":"SForum 2018 Final Technical Program Tuesday, Aug. 28 9:00h Malbec B \u2013 Tutorial Integrated switched-capacitor DC-DC converters for high-density capacitive energy storage Filip Tavernier (KU Leuven \u2013 Belgium) 10:20h Carmen\u00e8re - Coffee-Break 10:40h Malbec A \u2013 Tutorial DC and RF reliability of advanced CMOS technologies Edmundo Gutierrez (INAOE \u2013 Mexico)\u00a0\u2026","rel":"","context":"Post similar","block_context":{"text":"Post similar","link":""},"img":{"alt_text":"","src":"","width":0,"height":0},"classes":[]},{"id":1057,"url":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/wcas-2018-technical-program\/","url_meta":{"origin":959,"position":1},"title":"WCAS 2018 Technical Program","author":"agostini","date":"19\/07\/2018","format":false,"excerpt":"WCAS 2018 Final Technical Program Tuesday, Aug. 28 9:00h Malbec B \u2013 Tutorial Integrated switched-capacitor DC-DC converters for high-density capacitive energy storage Filip Tavernier (KU Leuven \u2013 Belgium) 10:20h Carmen\u00e8re - Coffee-Break 10:40h Malbec A \u2013 Tutorial DC and RF reliability of advanced CMOS technologies Edmundo Gutierrez (INAOE \u2013 Mexico)\u00a0\u2026","rel":"","context":"Post similar","block_context":{"text":"Post similar","link":""},"img":{"alt_text":"","src":"","width":0,"height":0},"classes":[]},{"id":1039,"url":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/sbcci-2018-technical-program\/","url_meta":{"origin":959,"position":2},"title":"SBCCI 2018 Technical Program","author":"agostini","date":"19\/07\/2018","format":false,"excerpt":"SBCCI 2018 Final Technical Program Papers assigned with an asterisk are the SBCCI2018 Best Paper Candidates. Tuesday, Aug. 28 9:00h Malbec B \u2013 Tutorial Integrated switched-capacitor DC-DC converters for high-density capacitive energy storage Filip Tavernier (KU Leuven \u2013 Belgium) 10:20h Carmen\u00e8re - Coffee-Break 10:40h Malbec A \u2013 Tutorial DC and\u2026","rel":"","context":"Post similar","block_context":{"text":"Post similar","link":""},"img":{"alt_text":"","src":"","width":0,"height":0},"classes":[]},{"id":986,"url":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/program-schedule\/","url_meta":{"origin":959,"position":3},"title":"Program Schedule","author":"agostini","date":"18\/07\/2018","format":false,"excerpt":"Chip in the Pampa 2018 Schedule Monday, Aug. 27 9:00h Assemblage - Event Registration 13:40h Pinot C - Meeting of SBMicro Board 13:40h Pinot D - Meeting of SBC\/CECCI Board 15:40h Pinot Lobby - Coffee-Break 16:20h Pinot A - Meeting of SBCCI Steering Committee 16:20h Pinot B - Meeting of\u2026","rel":"","context":"Post similar","block_context":{"text":"Post similar","link":""},"img":{"alt_text":"","src":"","width":0,"height":0},"classes":[]},{"id":1042,"url":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/sbmicro-2018-technical-program\/","url_meta":{"origin":959,"position":4},"title":"SBMicro 2018 Technical Program","author":"agostini","date":"19\/07\/2018","format":false,"excerpt":"SBMicro 2018 Final Technical Program \u00a0 Tuesday, Aug. 28 \u00a0 9:00h Malbec B \u2013 Tutorial Integrated switched-capacitor DC-DC converters for high-density capacitive energy storage Filip Tavernier (KU Leuven \u2013 Belgium) 10:20h Carmen\u00e8re - Coffee-Break 10:40h Malbec A \u2013 Tutorial DC and RF reliability of advanced CMOS technologies Edmundo Gutierrez (INAOE\u2026","rel":"","context":"Post similar","block_context":{"text":"Post similar","link":""},"img":{"alt_text":"","src":"","width":0,"height":0},"classes":[]},{"id":674,"url":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/sbmicro-2018-mohammad-al-faruque\/","url_meta":{"origin":959,"position":5},"title":"Tutorial: Edmundo Gutierrez","author":"agostini","date":"26\/04\/2018","format":false,"excerpt":"Edmundo Gutierrez National Institute of Astrophysics, Optics and Electronics (INAOE) - Mexico Tuesday, Aug. 28 - 10:40h -\u00a0Malbec A \u00a0 TUTORIAL: DC and RF reliability of advanced CMOS technologies I review the different experimental strategies and models to stress and degrade CMOS devices under DC and RF conditions. Based on\u2026","rel":"","context":"Post similar","block_context":{"text":"Post similar","link":""},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/wp.ufpel.edu.br\/chipinthepampa2018\/files\/2018\/04\/21edmundo-333x400.jpg?resize=350%2C200&ssl=1","width":350,"height":200},"classes":[]}],"_links":{"self":[{"href":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/wp-json\/wp\/v2\/pages\/959","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/wp-json\/wp\/v2\/users\/685"}],"replies":[{"embeddable":true,"href":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/wp-json\/wp\/v2\/comments?post=959"}],"version-history":[{"count":11,"href":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/wp-json\/wp\/v2\/pages\/959\/revisions"}],"predecessor-version":[{"id":1596,"href":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/wp-json\/wp\/v2\/pages\/959\/revisions\/1596"}],"wp:attachment":[{"href":"https:\/\/wp.ufpel.edu.br\/chipinthepampa2018\/wp-json\/wp\/v2\/media?parent=959"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}